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Aixtron’s MOCVD system for Micro LED wafers with 200mm wafers has been certified by ams and OSRAM

On February 14, ams-OSRAM issued a press release and jointly announced with Aixtron, a leading supplier of deposition equipment in the semiconductor industry, that the 200mm wafer AIXTRON G5+ C and G10-AsP systems have been certified by ams-OSRAM and can be used to meet the needs of Micro LED applications.
AIXTRON's MOCVD systems AIX G5+ C and the new G10-AsP provide AIXTRON planetary satellite air-floating rotation horizontal technology (Planetary Technology), paving the way for the next generation of high-resolution micro LED displays.
As early as the first quarter of 2022, ams-Osram announced a 200mm production capacity expansion plan to achieve LED and Micro LED production capacity in existing factories in Malaysia. The MOCVD system is expected to help realize the mass production of Micro LED and create a new generation of display applications.
Robe, Executive Vice President and Head of Optoelectronic Semiconductors Business at ams Osram rt Feurle said: "Aixtron and ams-Osram have a long-standing relationship and we are familiar with the performance and quality standards of their equipment. For challenging projects such as the development and production of Micro LEDs for AsP and GaN devices, Aixtron is exactly the partner we need."
Dr. Felix Grawert, CEO and President of Aixtron, added: "G10-AsP and AIX G5+ C has successfully obtained certification from ams Osram, which is a very important milestone in the history of our company. ams Osram is a leading global LED manufacturer and is well-positioned to bring new fundamental technologies to the market. Now, Aixtron is entering a future growth market with great potential, and we have an ideal partner to join us. ”
Micro. LED has very significant advantages, such as higher pixel density, longer service life, higher brightness, faster switching speed and wider color spectrum. One step further improves display technology. Relatively low energy consumption is also an important advantage, making Micro LED technology well suited for use in the next generation of consumer electronics devices with smaller displays, which often offer very limited space for batteries.
Micro LED has special production requirements: its mass production process includes a special batch transfer process step, where thousands of micron-sized LED chips (arrays) are picked and placed. Any defects can cause pixels to die, rendering the entire array useless. Therefore, an almost error-free epitaxial process must be used to minimize defects and support high yield and cost-effective Micro LED production.
Aixtron's new G10-AsP epitaxy tool has been carefully designed to meet the specific needs of this application. The new tool is the world's first fully automated AsP reactor, offering fully automated cassette-to-cassette wafer loading and an in-situ etch-based cleaning mechanism. These two characteristics combined can have a significant impact on yield.
In addition, batch reactor technology also This brings several advantages to the Aixtron system: its production cost per wafer is among the lowest on the market today, while its throughput per cleanroom area is among the highest. At the same time, the new tool features precise flow and temperature control to maintain very good material uniformity during continuous operation.

Source: ams-osram

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