Five departments including the Ministry of Industry and Information Technology: Improve the reliability of electronic components such as LED chips

On June 30, five departments including the Ministry of Industry and Information Technology issued the document "Implementation Opinions on Improving Manufacturing Reliability". The document proposes to focus on key industries such as machinery, electronics, and automobiles, focusing on the strategic goals of manufacturing and quality, and benchmarking against the advanced level of similar international products.

Image source: Ministry of Industry and Information

The goal is that by 2025, the reliability level of key core products in key industries will be significantly improved, the reliability standard system will be basically established, the quality and reliability management capabilities of enterprises will continue to be enhanced, the reliability test verification capabilities will be greatly improved, and the professional talent team will continue to grow. Build three or more common reliability technology research and development service platforms, form more than 100 typical demonstrations of reliability improvement, and promote more than 1,000 companies to implement reliability improvement. By 2030, the reliability level of 10 key core products will reach the internationally advanced level.

Among them, in the electronics industry, the focus will be on improving the reliability level of electronic components such as SoC/MCU/GPU and other high-end general-purpose chips for electronic equipment, wide bandgap semiconductor power devices such as gallium nitride/silicon carbide, precision optical components, optical communication devices, new sensitive components and sensors, highly adaptable sensor modules, Beidou chips and devices, chip resistive and capacitive sensing components, high-speed connectors, high-end radio frequency devices, high-end electromechanical components, LED chips and other electronic components.

Improve high-frequency and high-speed printed circuit boards and substrates, new display special materials, high-efficiency photovoltaic cell materials, key lithium battery materials, electronic pastes, electronic resins, electronic chemicals, new display electronic functional materials, advanced ceramic substrate materials, electronic assembly materials, advanced chip packaging materials, etc. Sub-material performance, improve component packaging and curing, epitaxial uniformity, defect control and other process levels, strengthen material analysis, destructive physical analysis, reliability test analysis, board-level reliability analysis, failure analysis and other analysis and evaluation technology research and development and standard system construction, and promote application in related industries.